THE FOLLOWING OUTLINE IS THE ACTUAL PROGRAM FROM THE

CONFERENCE FOCUS

This unique annual Thermal Printing Conference is the only thermal printing industry event devoted to a comprehensive assessment of thermal imaging technologies, markets and applications. The program focuses on technological advancements, design elements, materials developments and market issues that are critical to the continued competitiveness of thermal printing in specialty printing applications and the overall printer marketplace. Thermal printing's continued growth in many specialty market sectors has resulted from the market's capitalization on thermal printing's basic attributes of simplicity, reliability, excellent print quality and low operating costs. Conference speakers will discuss thermal and thermal transfer imaging's role in a wide range of end use markets as well as the design issues that contribute to thermal printing's continued success and growth in critical market sectors. Leading technologists and industry experts will address the innovations, trends and market forces that are shaping thermal printing's role in the overall printing industry. Don't miss this opportunity for hardware vendors, consumables suppliers, converters, component suppliers and end users to communicate and network with their counterparts from the thermal printing industry's leading companies.

BENEFITS OF CONFERENCE ATTENDANCE

Participate in the only 2005 program dedicated entirely to Thermal Printing Industry

Learn thermal printing technology developments and innovations being utilized and proposed to enhance printer applications and performance

Participate in interactive sessions and informal discussions on topics critical to the continued technological and market success of thermal printing systems

Obtain information on the current growth markets and applications that offer attractive opportunities

Learn subsystem component options and design tools to enable the most cost effective printer designs

Establish personal contacts with leading experts in thermal printing to evaluate factors essential to the continued advancement and market expansion of thermal printing

Gain knowledge to aid your company's strategic planning relative to thermal printing development, marketing and implementation

Have a complimentary table top display to inform the industry of your products and services

Give a five minute presentation during the popular Suppliers' Forum

CONFERENCE CHAIRMAN

Harold Schofield, Schofield Imaging Associates

CONFERENCE SPEAKERS:

Kenichi Asou, Dai Nippon Printing
Mark Carangi, Gulton
Dr. Charles S. Christ, Eastman Kodak
Richard P. Collins, Kyocera
Mike Cove, Appleton
Robert F. Danahy, Zebra Technologies
Tom Easley, AOI Electronics
Douglas M. Hall, Intermec Technologies
Jiro Oi, HIT Devices
Om Srivastava, Gulton
Yoshi Uesugi, Kanematsu
Rick Wallace, IIMAK
Andrew Wilkinson, ICI Imagedata
Dr. James Williams, Polyonics
T. Yamamoto, Rohm

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16th ANNUAL THERMAL PRINTING CONFERENCE May 16-18, 2005 Radisson Plaza Lord Baltimore Hotel Baltimore, Maryland Program Coverage and Schedule   Monday, May 16, 2005   11:00 am - 5:00 pm Conference Registration   1:00 p.m. Session 1- Market Development WELCOME AND INTRODUCTIONS Alvin G. Keene, President, Information Management Institute, Inc., Carrabassett Valley, Maine Harold Schofield, Schofield Imaging Associates, Narragansett, Rhode Island STATE-OF-THE INDUSTRY ADDRESS Harold Schofield, Schofield Imaging Associates, Narragansett, Rhode Island Conference Overview Industry Update For 2005 - Growth & Competition By Market Segment - What's New For 2005? Technology Update For 2005 - Printheads - Media - Products & Systems Competitive Outlook Future Trends NEW OPPORTUNITIES FOR THERMAL TRANSFER Rick Wallace, Senior Vice President & General Manager, Color Digital Systems & Supplies Group, IIMAK, Amherst, New York The Tag & Label Market - Overall Market - RFID Vs. Bar Codes: They Both Will Win - Clean Start: The Built In Printhead Cleaner Decorated Glass: The Thermal Transfer Answer-DecoTherm Brand Protection/Authentication: Thermal Transfer's Opportunity-Covert Inks For Label Printing RFID IN THERMAL PRINTING Douglas M. Hall, Director of Printer and Data Capture Marketing, Intermec Technologies Corporation, Everett, Washington RFID Standards Update Why EPC Gen2 Intermec & EPCglobal RFID Readers & Other Products RFID Printer Development Issues RFID Thermal Printers   5:30 p.m. Reception   Tuesday, May 17, 2005   7:00 a.m. Continental Breakfast   8:00 a.m. Session 2 - Media Advancements DIRECT THERMAL: EXPANDING HORIZONS... Mike Cove, Senior Marketing Manager, Thermal and Advanced Technical Products, Appleton, Appleton, Wisconsin Thermal Technology Has Stood The Test Of Time For Almost 40 Years & Is Still Going Strong Simplicity, Robustness & Cost Effectiveness Are Success Keys Direct Thermal Continues To Expand Its Horizons Into New Territories, Replacing Older Printing Technologies & Providing Completely New Printing Entities Recent Applications & Advances For Direct Thermal Technology Underlying Reasons For Its Choice Glimpses Of Future Applications NEW MARKET CREATION BY THERMAL MASS TRANSFER MEDIA Kenichi Asou, Assistant Manager, Information Media Laboratory, Dai Nippon Printing Co.,Ltd, Saitama, Japan Existing Thermal Transfer Ribbon Market Diversified Market Trend: Originality Requests From Users Printing Method Comparison: TTR Vs. Proper Printing & Other Digital Printing New Developments & Products - Endurance Performance Improvement - Color Expression: Half Tone Screening - Metallic Expression - Re-Transfer Printing - Printable Holographic Ribbon NEW PET BASED SUBSTRATES AND THERMALLY TRANSFERABLE SECURITY FEATURES FOR ID CARDS Andrew Wilkinson, Sales & Marketing Director, ICI Imagedata, Manningtree, Essex, UK Two Major Needs In ID Card Market - Higher Levels Of Visible Security Within Variable Data - Robust, Environmentally Friendly Substrate That Can Be Thermally Printed With Variable Information Development Of Two New Consumables Groups - Security Ribbons Allowing Variable Information Or Images To Be Thermally Printed Using Exotic Or Controlled Materials - PET (Polyester Based) Substrates Coated With Receptive Layer That Will Accept D2T2 Dyes & Other Thermally Transferred Materials Strengths & Weaknesses Of Digital Printing Technologies For ID Cards Basic Science Of Thermally Printed Security Features & Demonstration Of Different Techniques Comparison Of Traditional PVC Based Card Substrates Vs. New Coated PET Materials THERMAL DYE TRANSFER OVERPROTECTIVE LAMINATES Dr. Charles S. Christ, Intellectual Property Coordinator, Imaging Output Platform, Imaging Materials & Media, Kodak Research Laboratories, Eastman Kodak Company, Rochester, New York Importance Of Overprotective Laminate For Thermal Dye Transfer Prints Main Functions Of Laminate Key Parameters Required For Exceptional Product Performance: Effect Of Laminate On Light Fade & Environmental Pollutants Technology For Control Of Surface Gloss  12:00 Noon Luncheon   1:30 p.m. Session 3 - Printhead Developments Stimulate Growth Applications THERMAL PRINTING IN A DIGITAL WORLD Richard P. Collins, Vice President, I/O Sales Group, Kyocera Industrial Ceramics, Vancouver, Washington Global Market Overview Technology Advances Markets & Solution - Monochrome: Barcode, RFID & Performance Line, Mobile & Value Solutions - Color Markets: Digital Photo Printing, Card & Photo ID ("H" Series & 600 Dpi) & Medical ROHM THERMAL PRINTHEAD TECHNOLOGIES 2005 T. Yamamoto, Rohm LSI Systems, San Diego, California Thermal Printer Market Market Requirements Rohm TPH Technologies New Structure "Step-Free" Rohm TPH Line-Up AOI THERMAL PRINTHEADS Tom Easley, Director of Sales, AOI Electronics/Dynarex, Inc., San Jose, California Characteristics Of AOI Printheads Key Technology New Products Future Products THERMAL PRINTHEAD TECHNOLOGY: HOW DID THEY DO THAT? Om P. Srivastava, President & Mark Carangi, Engineering Manager, Gulton Incorporated, Methuen, New Jersey Thin Film Vs. Thick Film: Equivalent Electrical Circuit, Resistor Material, Application & Suitability, Thermal Response & Print Speed Thermal Printhead Form Factor: Near Edge-Partial Glaze & True Edge Interfacing To The Host Printer: Timing Relationships, Signals & Levels, Serial In/Parallel Out, Dot History Vs. Non Dot History & Power Per Dot Secret Life Of Printhead Coatings: Features, Advantages & Relative Life of Glass, DLC, Silicon Nitrate & DLN Printhead Failure Modes: Abrasive Life, Thermal Life, Chemical Reactions, ESD & Scratches/Cracks/Chips/Dirty Paper Future & Conclusions: Higher Resolution, Faster Print Speeds & Longer Life SUPPLIERS FORUM: 5-Minute Presentations Related To Technology, Capabilities, Services, New Product Introductions, etc. The Suppliers' Forum is open to all Conference Registrants   5:30 p.m. Reception   Wednesday, May 18, 2005   7:00 a.m. Continental Breakfast   8:00 a.m. Session 4 - Technology Developments & Product Implementations NEXT GENERATION PHOTO PRINTHEADS: TECHNICAL TRENDS, NEW TECHNOLOGIES & PRODUCTS Yoshi Uesugi, Information Media & Components, Kanematsu USA Inc., Somerset, New Jersey Toshiba Business Status Technical Overview In Photo Printer Market Introduction Of New Photo Printer Thermal Printhead - U-Shape 600 Dpi - Improved Printhead Performance Introduction Of Card Printer Thermal Printhead & Trend Forecast Introduction Of Consumer Photo Printer Thermal Printhead HEATING HEAD FOR SPECIAL THERMAL PRINTING APPLICATIONS Jiro Oi, Director, HIT Devices, US Office, Brentwood, Tennessee Technology Development Mainly For Thermal Rewritable Applications Challenges & Solutions Applications Future Possibilities: Double Thermal Transfer & Overcoating Applications MOBILE THERMAL PRINTING IN TODAY'S CHANGING WIRELESS ENVIRONMENT Robert F. Danahy, Director, Global Mobile and Wireless Technology, Zebra Technologies, Warwick, Rhode Island The Dynamics Of Mobile Printing Today's Evolving Wireless Environments Integrating Mobile Thermal Printing Into New Markets & Applications Growth Areas For Mobile Thermal Printing Challenges Of Networked Mobile Thermal Printing THERMAL PRINTING APPLICATIONS FOR METALLURGICAL PROCESS INDUSTRIES Dr. James Williams, Founder & Chairman, Polyonics Inc., Westmoreland NH Thermal Transfer Printed Bar Code Labels Can Survive 600 °C & Inks Do Not Ooze Or Smear Equipment & Materials Used For Marking Steel & Aluminum Slabs, Billets And Coils Current Limitations Of The Technology Future Trends For Thermal Transfer Printing At Extremely High Temperatures - Including Ceramics Applications  12:00 Noon Adjournment PRODUCT DEMONSTRATIONS - FREE DISPLAYS Product demonstrations/displays by both conference speakers and registrants are encouraged. IMI will cooperate with all interested parties to provide appropriate space so products can be displayed and demonstrated during the conference breaks and receptions. There is no charge in addition to the conference registration fee to have a display. Interested companies should contact Al Keene at IMI to ensure that proper arrangements are made for product displays and demonstrations. PAST CONFERENCE BINDER & CD-ROM The binder and CD-ROM for this completed program, containing handout materials from all speakers plus a registration list with names, addresses and phone numbers, may be purchased for: $300 US including shipping by Federal Express submit the order form now and follow with your payment by mail. Or … print the Mail-In Order Form , use the comments section to note the name of the binder you want, and mail or fax it to: Information Management Institute, Inc., 1106 Valley Crossing, Carrabassett Valley, ME 04947 – Fax: 207-235-2226. Or … or call 207-235-2225 to place your order. To order a 16th ANNUAL THERMAL PRINTING CONFERENCE binder online, please fill in the blanks, then select the "Send to IMI…" button. Mr. Ms. Mrs. Dr. Name Job Title Organization/Company Mail Address City State, Country, Zip/Postal Code Daytime Phone Fax E-Mail Address Comments Press To send your order. Press To clear the form and start over. All checks should be in U.S. dollars drawn on a U.S. bank and made payable to Information Management Institute, Inc. An invoice with bank transfer details for IMI's U.S. or European bank account will be provided upon request. Return to Information Management Institute Master Schedule

 

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