The 1^st Digital Electronic Materials Deposition Conference is designed to bring together leaders in the area of digital electronic materials deposition. With the multitude of electronic devices being fabricated coupled with increased pressure to reduce size, increase circuit density & functionality and decrease cost; digital electronic materials deposition methodologies are rapidly evolving. Electronic materials deposition offers an attractive value proposition that can be implemented in the fabrication of a variety of devices and components. Deposition technologies such as ink jet printing, syringe dispense, micro-stamp and aerosol jet offer unique solutions to the electronics industry where high-speed, re-configurable, roll-to-roll compatible and low cost processing need to be realized. A host of organizations are developing both materials and deposition technologies in this area and commercialization is being realized. This unique conference program, the only one of its kind to date, will provide tool developers, materials developers, integrators and end-use device manufacturers the opportunity to meet in one place to assess this rapidly evolving field, which may well be one of the most important enablers for the continued advancement of the electronics industry.

Monday, October 14, 2002

11:00 a.m. - 5:00 p.m.

Registration

1:00 p.m.

Opening Session - Market & Implementation Overview

WELCOME AND INTRODUCTIONS
Alvin G. Keene, President, Information Management Institute, Inc., Kingfield, Maine

MARKETS FOR PLASTIC ELECTRONICS
Thomas McLean, Avecia, Manchester, England

• Why Bother With Plastic Electronics?
• What Markets Will Plastic Electronics Create & Disrupt?
• What Has To Happen To Bring Those Markets About?
• Which Digital Imaging Technologies Will Work For Plastic Electronics?
• What Does The Road Map Look Like To Get There?

INK JET FOR ELECTRONIC MATERIALS DEPOSITION AND PRINTING
Dr. Ross N. Mills, President, imaging Technology international Corporation, Boulder, Colorado

• Electronic Applications
• Ink Jet Technology
• "Jettability" Requirements
• Available Printheads
• Deposition & Printing
• Challenges For Ink Jet

THE FEASIBILITY OF USING ELECTROSTATIC TECHNOLOGY FOR DEPOSITION OF CONDUCTIVE MATERIALS
J. Randolph Sanders, President, Torrey Pines Research, Carlsbad, California

• What Are Conductive Materials?
• What Electrostatic Deposition Technologies Currently Exist?
  - Overview
  - Which Are Suitable For Handling Conductive Materials
  - Advantages/Disadvantages Of Each
  - Potential Applications
  
• Where Is The Technology Headed?

MANUFACTURING FLAT PANEL DISPLAYS (FPDs) WITH DROP ON DEMAND (DOD) INK JET PRINTHEADS
Dr. Linda Creagh, Business Development Director, Spectra, Inc., Lebanon, New Hampshire

• Introduction To FPDs Based on Polymeric Light Emitting Devices (PLED)
• Requirements For Digital Manufacture Of FPDs
• Design Of DOD Printheads For Display Manufacture
• PLED Plus Ink Jet Works!
• Moving From Laboratory To Factory

INK JET PRINTING OF ELECTRONICS
Donald J. Hayes, President, MicroFab Technologies, Inc., Plano, Texas

• Electronics In Its Broadest Sense: Integrated Passives, Conductors & Electrical Internconnects, Organic Semiconductors, Displays, Smart Cards, RFIDs, Disposable Electronics, Pre-pay Cell Phones, Photonics, Etc.
• Review Of Key Applications
• Drivers & Road Maps
• Status 2002
• Current Research Activities: Over 250 Institutions Worldwide Currently Conducting Ink Jet Printing Of Electronics
• Key Technology & Infrastructure Gaps
• Standards: Is It Too Early To Start?

5:30 p.m.

Reception

Tuesday, October 15, 2002
7:00 a.m.	Continental Breakfast

8:00 a.m.

Alternative Electronic Materials Deposition Technologies

MASKLESS MESOSCALE MATERIAL DEPOSITION™ (M³D™) FOR DIRECT-WRITE ELECTRONICS
Dr. Bruce King, M³D Team Leader, Optomec, Inc., Albuquerque, New Mexico

• M³D™ : Method For Writing Fine Feature Size Electronic Circuits Directly From CAD File Without Mask Sets
  - Utilizes Flow Guidance Technology: Co-Flow Gas Used To Focus Stream Of Atomized Materials
  - Liquid Source Material Is Atomized & Entrained In Gas Stream
  - Enables Patterns To Be Written Over Existing Structures, Across Curved Surfaces & Into Channels/Vias
  - Deposited Materials Typically Post Treated Thermally (Or With Laser) To Attain Final Electronic/Mechanical Properties & Adhesion
  
• Process Features
  - High Resolution Deposition - Typically 25-50 Microns
  - Conformal Deposition
  - Low Temperature Substrate Compatibility
  - Ability To Produce Conductors, Resistors & Dielectrics
  

LASER DIRECT-WRITE DEPOSITION AND MICROMACHINING FOR FABRICATION OF ELECTRONIC CIRCUITS
Dr. Michael T. Duignan, Vice President Research & Development, Potomac Photonics, Inc., Lanham, Maryland

• New Laser Sources & High Speed Direct-Write Techniques Offer Efficient & Flexible Manufacturing Of Electronic Circuits & Components
• New Processes Which Permit Fabrication Of Microelectronic Components Using A Laser Direct-Write Process
• Rapid Maskless Patterning Of Variety Of Materials: Conducting Metals, Dielectrics & Resistor Compositions
• Minimum Feature Size Of The Order Of 10 Microns (0.0004")
• Ability To Pattern Layers On Polymers, Glasses, Ceramics & Composites
• Approach Employs Laser Forward Transfer Technique To Transfer Directly From Carrier Ribbon To Receiver Substrate
• When Carrier Ribbon Is Removed, UV Laser Based Direct-Write Machine Functions As Complete Micromachining Workstation - Added Functionality Enables Maskless Patterning, Laser Trimming, laser Machining, Via Drilling & Component excision All On Single Integrated Platform
• Combination Of Direct Additive & Subtractive Processes Results In Powerful Approach To Flexible Manufacturing
• Demonstrated Fabrication Of Sophisticated Passive LCR Bandpass Filter Designed To Operate Near 1 GHz
  - Laminated Multilayer Device Fabricated Completely On Polyimide Substrate
  - Device Contains Embedded Resistors, Capacitors & Inductors
  - Interlayer Connections Created Through Laser Drilled Vias
  - Processing Temperatures Did Not Exceed 350°C
  - No Masks, Resists, Vacuum Deposition Or Electroplating Were Used
  

DEPOSITION OF THICK FILM INKS (AND OTHER MATERIALS) USING SYRINGE TECHNIQUES
Bob Reed, General Manager, MicroPen Division of OhmCraft, Inc. Honeoye Falls, New York

• Comparison Of Positive Displacement/Syringe Method Of Materials Deposition With Other Dispensing Methods
• Positive Displacement/Syringe Improvements Over Past 2-3 Years
  - Ink Materials
  - Equipment
  
• Problems To Be Overcome To Create Repeatable Ultra Fine Depositions

THE ROLE INDUSTRIAL INK JET CAN PLAY IN LOW COST ELECTRONICS AND DISPLAY MANUFACTURING
Chuck Edwards, President, Litrex, Pleasanton, California

• Architecture & System Requirements For Clean Room Compatible Industrial Ink Jet Systems Versus Graphics Ink Jet Systems
• Current LCD and OLED Ink Jet Manufacturing Processes & Materials Under Development. These include Ink Jet Printing Of Pedot, Color & Monochrome LEPs (Light Emitting Polymers), Color Filters, PI, Etc.
• Flat Panel Displays (FPDs) From Low Resolution Passive Cell Phones To High Resolution LTPS Monitors & TVs: What Are The Limitations, Yields & Capabilities We Can Expect From Industrial Ink Jet?
• Other FPD & Electronics Technologies Like PCB Interconnect, Embedded Passives & Polymer Transistors Where Ink Jet Promises To Reduce Costs & Simplify Manufacturing
• "Disposable" Displays & Electronics: What Is The Future Of Industrial Ink Jet & Materials?

12:00 p.m.

Luncheon

1:30 p.m.

Materials Deposition

CHALLENGES IN THE FORMULATION OF ELECTRONIC MATERIALS SUITABLE FOR DIGITAL DEPOSITION
Dr. Toivo T. Kodas, Vice President Technology, Superior MicroPowders, Albuquerque, New Mexico

• Critical Materials Needs For Digital Deposition Technologies: Ink Jet, Aerosol Jet, Laser Transfer & MicroSyringe
• Shortcomings Of Traditional Materials Technologies
• Key Materials Parameters For Successful Digital Deposition
• Development Of Digital Deposition Specific Electronic Materials

INK JET PRINTING METALS WITH HIGH ELECTRICAL CONDUCTIVITY
Dr. Alan Hudd, Managing Director, Xennia Technology and Dr. Phil Bentley, Senior Scientist, Conductive Inkjet Technology Ltd., Royston, Hertfordshire, England

• Challenges & Requirements To Ink Jet Print Highly Conductive Materials
• Properties & Characteristics Needed for Ink Jet Printing
• Dedicated Initiative To Solve Problems For A Variety Of Electronics Applications
• Introducing Conductive Inkjet Technology Ltd.
• Novel Approaches To Create Robust & Accurate Solutions
• Application Performance Achievements

INK JET PRINTED CONDUCTORS AS INTERCONNECTS
Olivier Brunet, R&D Engineer, Gemplus, Gemenos, France

• Promise Of Ink Jet For Next Generation Of Low Cost Interconnection Technology Opens New Opportunities To:
  - Interconnect Very Thin (less than 25 µm) Chips
  - Enable Very Thin & Flexible Packaging For Smart Cards/Labels
  
• Proven In Smart Card Area-Next Target Is Conductive Line Printing
• Parameters & Criteria For Ink Jet Printhead - Drop Fluid Ejection Possibilities
  - Available Ink Technologies
  - Conductivity
  - Final Line Deposition Perspective
  
• Potential To Replace Wire Bonding Interconnections With Conductive Line Deposition

SUPPLIER'S FORUM
5 Minute Presentations Related To New Digital Electronic Materials Deposition Product
or Service Capabilities: Open to all Conference Registrants

5:30 p.m.

Reception

Wednesday, October 16, 2002
7:00 a.m.	Continental Breakfast

8:00 a.m.

Commercial Successes, User Experiences & Needs

INK JET PRINTING FOR CIRCUIT BOARD MANUFACTURE
Giles Branthwaite, Business Development, Avecia Ink Jet Printing Materials, Manchester, England

• How Can Ink Jet Add Value To The PCB Industry?
• What Technological Development Issues Result?
• When Can We Expect These Issues To Be Overcome?
• What Other Markets Could This Technology Enter?

THE POWER OF ELECTRONICS + THE PERVASIVENESS OF PRINTING
Dr. John Mills, Vice President Engineering, Plastic Logic Limited, Cambridge, England

• Plastics Electronics Technology: New Field Recognized As A Disruptive Technology
• Plastic Logic
  - Spin Out From Cambridge University's Cavendish Laboratory
  - Raised Over $12 Million To Develop/Commercialize Patented Technology
  - International Collaboration With Dow Chemical & Seiko Epson
  
• Printing Transistors & Active Electronic Circuits From Soluble Plastics Using Ink Jet Printing
• Techniques & Materials Used For Solution Deposition
• Technology/Applications Road Map
• Potential Collaboration Opportunities

DIGITAL ELECTRONIC MATERIALS DEPOSITION FOR FLAT PANEL DISPLAY MANUFACTURE
Dr. Masahiko Ando, Senior Researcher, Hitachi Research Laboratory, Department of Imaging Devices Research, Ibaraki-ken, Japan

• Typical Specifications & manufacturing processes Of Flat Panel Display Technologies
• LCD, PDP, OLED, Etc. Technologies
• Digital Electronic Materials Deposition Technologies: Pattern Resolution, Process Temperature, Electrical & Mechanical properties, Etc.

DEPOSITION AND PATTERNING ISSUES IN ROLL-TO-ROLL MANUFACTURING OF MICROELECTRONICS
Dr. James Sheats, Vice President of Technology, Rolltronics, Menlo Park, California

• Roll-To-Roll Deposition Industry: Vacuum & Fluid
• Roll-To-Roll Patterning Processes
• Needs Of Emerging Large Area, Low Cost Electronics Field
• R & D Challenges And Opportunities For Digital Deposition

YIELD MANAGEMENT IN VOLUME PRODUCTION OF HIGH DENSITY INTERCONNECT SUBSTRATES
Ton Schless, Vice President - General Manager, MIDAS Vision Systems, Inc., Foxboro, Massachusetts

• Measurement Vs. Inspection
• Measurement Leads To SPC
• Inspection Leads To Defect Detection
• Defect Detection Leads To Process Characterization
• Defect Data Leads To Yield Improvement

12:00 Noon

Closing Luncheon & Adjournment

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