THE FOLLOWING OUTLINE IS THE ACTUAL PROGRAM FROM THE

October 20-22, 2003

Chaparral Suites Hotel
Scottsdale, Arizona

CONFERENCE CO-CHAIRS

Dr. James Caruso, Cabot - Superior MicroPowders  james_caruso@cabot-corp.com
Dr. John Mills, Plastic Logic  john.mills@plasticlogic.com

Nick Balon, Conductive Inkjet Technology
Giles Branthwaite, Avecia
Julian Carter, CDT
Leo Claassen, Phillips CFT
Dr. Kenneth H. Church, nScrypt
Dr. Linda T. Creagh, Spectra
Chuck Edwards, Litrex
Eran Elizur, Creo
Ian Gardner, Fujifilm
Donald J. Hayes, MicroFab
Howard Imhof, Metalor
Walter Mathias, OhmCraft
Dr. Ross N. Mills, iTi
Robin Pittson, Gwent Electronic Materials
Dr. Mike Renn, Optomec
Dr. John Scott, Patterning Technologies
Dr. ir. D.B. van Dam, Phillips
Dr. Karel Vanheusden, Cabot - Superior MicroPowders
Liz Ziepniewski, I T Strategies Inc.

CONFERENCE FOCUS

The 2^nd Annual Digital Electronic Materials Deposition Conference is designed to bring together leaders in the area of digital electronic materials deposition for both high-resolution features and large area coatings. With the multitude of electronic devices being fabricated coupled with increased pressure to reduce size, increase circuit density & functionality, decrease cost and to cope with a wider variety of substrates including low temperature plastics; digital electronic materials deposition methodologies are rapidly evolving.

Digitally deposing conductors, resistors, dielectrics, light emitting materials, semiconductors and others offer an attractive value proposition that can be implemented in the fabrication of a variety of devices and components including flexible displays, organic transistors, RFID tags, printed circuit boards and sensors.

Deposition technologies such as ink jet printing, syringe-dispense, micro-stamp, aerosol jet, laser-based methods and others offer unique solutions to the electronics industry where additive, re-configurable, high-resolution solutions are required. Furthermore, additional capabilities include high speed sheet-fed or roll-to-roll processing, conformality and in many cases low cost processing. A host of organizations are developing both materials and deposition technologies in this area and commercialization is being realized. This unique conference program, the only one of its kind to date, will provide tool developers, materials developers, integrators and end-use device manufacturers the opportunity to meet in one place to assess this rapidly evolving field; a field which will change the way electronic-based devices are designed and fabricated in the years to come.

BENEFITS OF CONFERENCE ATTENDANCE

Learn the current state of the art for digital electronic materials deposition technologies (for high resolution, small feature size to large area coatings) and gain first hand knowledge from current users, recognized experts and industry pioneers.

Obtain understanding of electronic materials issues related to digital deposition methods

Hear from leading system integrators and tool developers involved in digital electronic materials deposition

Learn the electronics industry's needs from key end users and device manufacturers

Gain an understanding of the significant market for digital electronic materials deposition

Receive an appreciation for the challenges and issues requiring attention if digital electronic material deposition is to expand in importance in the commercial world

Establish personal relationships with key players in the electronics, materials and digital printing fields

Gain knowledge of the technology developments being made and still required to meet the needs of digital electronic materials deposition

Display your digitally printed electronic related products, technologies, services, etc. with a complimentary table top display space

Give a 5-minute presentation on your products, technologies or services in the Suppliers' Forum

2nd Annual Digital Electronic Materials Deposition Conference October 20-22, 2003 Chaparral Suites Hotel Scottsdale, Arizona Program Coverage and Schedule   Monday, October 20, 2003   11:00 a.m - 5:00 p.m. Conference Registration   1:00 p.m. Market & Implementation Overview WELCOME AND INTRODUCTIONS Alvin G. Keene, President, Information Management Institute, Inc., Carrabassett Valley, Maine A PERSPECTIVE ON ELECTRONIC MATERIALS TECHNOLOGY Howard Imhof, Director Sales & Marketing, Metalor Technologies, Attleboro, Massachusetts Evolution Of Electronic Materials Technology Traditional Materials, Deposition Methods & Uses Strengths & Weaknesses Of Today's Electronic Materials Technology Future Needs & Possible Directions THE POWER OF ELECTRONICS + THE PERVASIVENESS OF PRINTING Dr. John Mills, Vice President Engineering, Plastic Logic Limited, Cambridge, England Plastics Electronics Technology: New Field Recognized As A Disruptive Technology Plastic Logic - Spin Out From Cambridge University's Cavendish Laboratory - Raised Over $17 Million To Develop/Commercialize Patented Technology Progress on fully printed active matrix backplanes for electronic paper and LCD applications First discussions on PL's use of direct write laser patterning Printing Transistors & Active Electronic Circuits From Soluble Plastics Using Ink Jet Printing Techniques & Materials Used For Solution Deposition Technology/Applications Road Map Potential Collaboration Opportunities SYSTEM INTEGRATION FOR INK JET MATERIALS DEPOSITION Dr. Ross N. Mills, President, imaging Technology international, Boulder, Colorado Applications System Parameters Ink Jet Technology "Jetability" Requirements Available Printheads System Integration Deposition Systems Challenges For Ink Jet SORTING THROUGH THE OPPORTUNITY CLUTTER: THE BEST MARKETS FOR ELECTRONIC MEDIA Liz Ziepniewski, Consultant, I.T. Strategies, Inc., Hanover, Massachusetts The World Of Print: $1 Trillion In Opportunity Sizing & Segmenting Narrow & Wide Format Print Opportunities & Applications Print Drivers (Advertise, Inform, Educate, Functional): What Offers The Best ROI Target Markets: Breaking Through The Clutter & Finding The Best Application Segments Value Propositions Driving Acceptance ROI: The Financial Justification Target End Users: Finding The Customer Barriers To Implementation Growth Strategies A ROUTE MAP TO PROCESS SIMPLIFICATION: PHOTOLITHOGRAPHY TO DIRECT PRINTING Dr. John Scott, Patterning Technologies Limited, Hempstead, Hertfordshire, UK Removing The Need for Photolithography For Etchmask Printing Cost Reduction Benefits Direct Printing Of Transparent Conductors Applications Areas For These Technologies   5:30 p.m. Reception   Tuesday, October 21, 2003   8:00 a.m. Alternative Electronic Materials Deposition Technologies ADVANCES IN PRECISION INK JET DEPOSITION OF ELECTRONIC MATERIALS Dr. Linda T. Creagh, Business Development Director, Spectra, Inc., Denton, Texas Piezoelectric Ink Jet Offers Productivity, Reliability & Uniformity Printhead Design Specifically To Meet Display Manufacturing Specs SX-128 Printhead Usage In Pilot Production Of LEP-Based FPDs & In Major R&D Facilities Applications Ranging From Liquid Crystal Alignment Layer Deposition To Color Filter Creation ADVANCED SYRINGE BASED DIGITAL ELECTRONIC MATERIALS PRINTING Dr. Kenneth H. Church, Chief Technical Officer, nScrypt, LLC, Stillwater, Oklahoma Basics Of Syringe Dispensing Issues That Have Limited Syringe Performance & Solutions To Issues Material & Substrate Interactions Conformal & Dynamic Dispensing Component & Device Demonstrations Advanced & Large Area Solution DIRECT WRITE MEETS THE REAL WORLD - AN APPLICATION PRIMER Walter Mathias, Vice President, OhmCraft, Inc., Honeoye Falls, New York Direct Write Techniques Solving Real World Application Needs In Aerospace, Automotive, Electronic, Energy Conservation, Military & Heater Markets Key Drivers Of Successful Direct Write Solutions Future Trends & A Development Roadmap Review Of Inks & Basic Direct Write Dispensing Issues MASKLESS MESOSCALETM MATERIALS DEPOSITION (M3D) Dr. Mike Renn, Senior Scientist, Optomec Inc., Albuquerque, New Mexico Maskless Mesoscale Deposition (M3D): Technology For Producing Electronic Features Down To 25 Micron No Masks Or Resists: Deposits Can Be Made on Virtually Any Surface Material & Eliminates Waste Electronic Features As Small As 10 Microns With Laser Treatment Option Deposits Low & High Viscosity Materials On Non-Planar Substrates Achieves Conformal Writing Due To No Physical Contact With Substrate THERMAL LASER IMAGING FOR ELECTRONIC DEVICE MANUFACTURING Eran Elizur, Director, Business Development, Creo, Inc., Burnaby, British Columbia, Canada Leading Provider of Laser Patterning Equipment For Computer-To-Plate Applications With Over 5,000 Installations Developing Laser Patterning Equipment For Display & Electronics Applications Imaging & Equipment Developments Applications In Displays & Electronics - Thermal Transfer For Manufacturing LCD Color Filters - Thermal Transfer For Creating Ink Jet Barrier Ribs - Patterning By Means Of Surface Energy Modification  12:00 Noon Luncheon   1:30 p.m. Commercial Successes, User Experiences & Needs ELECTRONICS MANUFACTURING BASED UPON INK JET PRINTING Donald J. Hayes, President, MicroFab Technologies, Inc., Plano, Texas Spreading Contention That Ink Jet Technology & Electronic Manufacturing Are Made For Each Other Results From Electronic/Photonic Deposition Study Ongoing Research At 100's Of Companies & Research Organizations Key Technology Developments Required For Ink Jet Printing Production Platforms Key Infrastructure Issues & Gaps In Technology Requiring Resolution APPLICATION OF ETCH RESIST AND SOLDERMASKS BY INK JET: PCB END USER EXPERIENCES Giles Branthwaite, Business Development, Avecia Ink Jet Printing Materials, Manchester, England Exploration Of Benefits Ink Jet Printed Etch Resist & Soldermask Can Bring To PCB Industry PCB House Experiences Using JETRACKTM - Based Ink Jet Fluids: Benefit Achievement & Issues Experienced Future Hurdles For Ink Jet Adoption In PCB Market INK JET PRINTING LIGHT EMITTING POLYMER DISPLAYS Dr. Julian Carter, Deposition Group Manager, CDT. Ltd., Cambridge, UK Unique Challenges Printing Semiconducting Polymer Materials - Very Stringent Drop Registration & Drop Volume Requirements - Constraints Imposed By Material Set Meeting Challenges Developing Pilot Scale Manufacturing Process - Developing Suitable Drop Metrology - Developing "Toolkit" Of Solvents That Allow Optimization Of Jetting & Film Forming Characteristics Of Semiconducting Polymer Inks INK JET PRINTING FOR POLYMER LED's AND INORGANIC CONDUCTORS Dr. ir. D.B. (Dirkjan) van Dam, Senior Scientist, Philips Research Laboratories, Eindhoven,The Netherlands Ink Jet Printing For Manufacturing Of Polymer Light Emitting Displays & Inorganic Conductors Possible Future Manufacturing Of Thin Film Resistors On Active Plate Of An AMLCD SUPPLIERS' FORUM: 5-Minute Presentations Related To New Digital Electronic Materials Deposition Technology, Product or Service Capabilities. The Suppliers' Forum is open to all Conference Registrants   5:30 p.m. Reception   Wednesday, October 22, 2003   8:00 a.m. Development, Commercialization & Implementation Issues ELECTRONIC MATERIALS TECHNOLOGY FOR THE EMERGING LOW COST PRINTING INDUSTRY Dr. Karel Vanheusden, Manager and Project Leader, Cabot - Superior MicroPowders, Albuquerque, New Mexico Providing A Complete Solution For Direct High Resolution Printing Of Pure Metallic Features On Low Cost Substrates Low Cost Printing Of Metallic Features For Flat Panel Displays Technological Challenges Innovative Ink, Printing & Processing Technology Technology Roadmap & Broader Market Opportunities Collaborations PROGRESS IN INDUSTRIAL INK JET PRINTING OF FLAT PANEL DISPLAYS: MOVING FROM THE LAB INTO PRODUCTION Chuck Edwards, President, Litrex, Pleasanton, California Nearly A Dozen Companies Have Successful PLED Displays Using Ink Jet Technology With Increasing PLED Display Life, Several Are Moving Toward Production Current Ink Jet Printing Technology Issues Faced In Moving From Lab Into Factory - Yield - Throughput - Cost Of Ownership - Reliability INK JET PRINTING METALS TO CREATE CONDUCTIVE FEATURES Nick Balon, Business Development Manager, Conductive Inkjet Technology, Royston, UK Conductive Inkjet Technology: One Year On Fundamentally New Approach To Depositing Conductive Metals Onto Range Of Flat & 3D Plastic Substrates Performance Characteristics Of Ink Jet Printed Metals Benefits Versus Other Technologies Potential Applications: Some Examples Technical Challenges Ahead Implementation Models FLATBED SYSTEMS PLATFORM FOR LARGE AREA PROCESSING Leo Claassen, Project Manager, Mechatronics Equipment, Philips CFT, Eindhoven, The Netherlands Introduction Of Philips Centre For Industrial Technology Trends In Large Area Processing & Its Application Field Development Of System Platform Design Objectives & Considerations Pilot Implementation of Ink Jet Print Process ADVANCED ELECTRONIC AND BIO-SENSOR MATERIALS AND THE RELEVANCE OF DIRECT WRITING SYSTEMS Robin Pittson, Technical Director, Gwent Electronic Materials, Gwent, UK Limitations Of Serigraphic Techniques For Advanced Applications Comparison Of Direct Writing & Serigraphic Formulations Advanced Nano-Particle Technology & Advanced Metallo-Organic Materials Systems: Their Use For Direct Writing Technology Advances In Polymeric Systems Advances In Biomaterials & Applications In Direct Writing Techniques Industrial Uses Of Advanced Material Systems SYSTEMS DEVELOPMENT & MANUFACTURING FOR DIGITAL PROCESSING OF ELECTRONIC MATERIALS Ian Gardner, Fujifilm Electronic Imaging Ltd., Hempstead,Hertfordshire, UK System Integrators Challenge: Develop Tools To Enable Device Production Breadth Of Technologies Requires Multidisciplinary & Modular Systems Approach Key Aspects of Development & Manufacture For Ink Jet Based Process Tools  12:30 p.m. Adjournment Download a PDF version of this program by   clicking here (october2003.pdf - 296K bytes) Speaking Opportunities at IMI Conferences If you have a potential topic for presentation at this or another IMI conference, please submit your proposed presentation topic and a brief outline to Al Keene at IMI (Email to imi@imiconf.com or fax to +1-207-235-2226) for review. IMI is always looking for potential speakers for upcoming conference programs and will be pleased to discuss your ideas for potential presentation topics. PRODUCT DEMONSTRATIONS - FREE DISPLAYS Product demonstrations/displays by both conference speakers and registrants are encouraged. IMI will cooperate with all interested parties to provide appropriate space so products can be displayed and demonstrated during the conference breaks. There is no charge in addition to the conference registration fee to have a display table. Interested companies should contact Al Keene at IMI to ensure that proper arrangements are made for product displays and demonstrations. PAST CONFERENCE BINDER & CD-ROM The binder and CD-ROM for this completed program, containing handout materials from all speakers plus a registration list with names, addresses and phone numbers, may be purchased for: $300 US including shipping by Federal Express submit the order form now and follow with your payment by mail. Or … print the Mail-In Order Form , use the comments section to note the name of the binder you want, and mail or fax it to: Information Management Institute, Inc., 1106 Valley Crossing, Carrabassett Valley, ME 04947 – Fax: 207-235-2226. Or … or call 207-235-2225 to place your order. To order a 2nd Annual Digital Electronic Materials Deposition Conference binder online, please fill in the blanks, then select the "Send to IMI…" button. Mr. Ms. Mrs. Dr. Name Job Title Organization/Company Mail Address City State, Country, Zip/Postal Code Daytime Phone Fax E-Mail Address Press To send your order. Press To clear the form and start over. All checks should be in U.S. dollars drawn on a U.S. bank and made payable to Information Management Institute, Inc. An invoice with bank transfer details for IMI's U.S. or European bank account will be provided upon request.

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